Texture and Residual Stress Analyses Print

Texture and Residual Stress Analyses (XRD3)

We use area detectors for efficient scanning of reciprocal space for diffraction from polycrystalline solids. We have developed unique techniques for quality and orientation analyses of electronic thin films and nanowire surfaces, including visualization of the full diffraction pattern, and real-time scanning of raw pole figures (MAX3D). Quantitative component orientation distribution analyses are performed using Bruker’s Multex Area 3 software. Leptos (Bruker-AXS) is used for residual stress analysis with area detector data. Co radiation is used to eliminate fluorescence from ferrous materials. The new Bruker Vantec500 detector is a zero background, real-time area detector, which allows for high speed, high resolution powder diffraction. We also have low and high temperature accessories - sample temperature range: 90K to 900K, and x-y mapping capabilities.

Bruker D8 Davinci, Vantec 500 area detector, focussed Co/Cu

Bruker Smart6000 CCD, Rigaku parallel-beam Cu rotating anode

 

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